Investing.com -- Mizuho Securities Asia raised its forecast for TSMC's monthly CoWoS packaging capacity to 140,000 units by 2026 and 190,000–200,000 units by 2027, up from prior estimates of 120,000 and 170,000–180,000 respectively, as a sharply upgraded outlook for AI-driven server CPU demand forces a broad revision to the firm's semiconductor supply model.