Samsung Electronics said on Friday it has started shipping ‌samples of its latest high-bandwidth memory (HBM) ‌chip, or the 12-layer HBM4E, marking what it said ​was the industry's first shipment of such products. Samsung said the chip uses its latest ⁠1c DRAM process technology, or sixth-generation 10-nanometer-class DRAM, alongside Samsung's 4-nanometer foundry logic base die. The move comes just three months after Samsung began shipping its HBM4 chips to customers in February, underscoring Samsung's ‌efforts to strengthen its ​position in the next-generation ​AI memory market ​by proactively supplying samples of ‌its latest products.